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Research & Development
Publications
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Ceramic Microwave Circuits for Satellite Communication (PDF, 11179.5 KB)
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R. Kulke, G. Möllenbeck, C. Günner, P. Uhlig, K. H. Drüe, S. Humbla, J. Müller, R. Stephan, D. Stöpel, J. F. Trabert, G. Vogt, M. A. Hein, A. Molke, T. Baras, A. F. Jacob, Dieter Schwanke, J. Pohlner, A. Schwarz, G. Reppe.
Journal of Microelectronics and Electronic Packaging (2009) 6
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Validation of Alternative RoHS Compliant Au Pastes for the DuPont LTCC 951 System (PDF, 23085.5 KB)
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Bernhard Mussler, Dieter Schwanke.
Journal of Microelectronics and Electronic Packaging (2009) 6
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Enhancement of Fine Line Print Resolution due to Coating of Screen Fabrics (PDF, 19171.8 KB)
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Dieter Schwanke, Jürgen Pohlner, Andreas Wonisch, Torsten Kraft, Jürgen Geng.
Journal of Microelectronics and Electronic Packaging (2009) 6
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Projekt "Nanosieb" (PDF, 9405.3 KB)
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Vortrag am 05.05.2009, SMT Messe Nürnberg 2009, Messestand µTP, Kompetenznetzwerk Mikrotechnische Produktion
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Tagungsband "Production Research for Micro- and NanoTechnology" (PDF, 4194 KB)
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MiNaT, Stuttgart, October, 7th - 9th, 2008
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Funktionelle Schichtungen auf Siebdruckgeweben und deren Charakterisierung (PDF, 9600.2 KB)
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Christoph Pönisch, Dr. Dieter Schwanke, Prof. Dr. Marek Gorywoda, Dr. Jürgen Geng, September 2008, MSE Berg
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Validation of Alternative RoHS Compliant Au-pastes for the DuPont LTCC 951 System (PDF, 3934.2 KB)
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Proceedings 2008 IMAPS/ACerS 4th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT), April 21-24, 2008, Munich, Germany
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Enhancement of Fine Line Print Resolution due to Coating of Screen Fabrics (PDF, 2215.1 KB)
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Proceedings 2008 IMAPS/ACerS 4th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT), April 21-24, 2008, Munich, Germany
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Baugruppen auf anorganischen Schaltungsträgern S.197 bis 211 in Innovative Produktionsprozesse für die Hochtemperaturelektronik
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Dieter Schwanke, Thomas Haas, ISBN 3-934142-52-4, Verlag Dr. Markus A. Detert, Templin, Mai 2005
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Ceramic Interconnect and Ceramic Microsystems Technology (CICMT) (PDF, 645.3 KB)
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Jens Müller: Baltimore/MD, April 10-13, 2005.
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LTCC - a Promising Technology for High-Frequency System-in-Packages (PDF, 159.5 KB)
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Jens Müller, Gerhard Kahmen, Roland Schumann, Nihal Sinnadurai, MicroTech 2005, March 1-2, 2005, Cambridge, UK.
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Thermische Untersuchung und Bewertung von LTCC-Mikrowellen-Gehäusen
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Christoph Kluge, Heiko Thust, Michael Hintz, Dieter Schwanke, Deutsche IMAPS Konferenz 2005, München
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Temperaturstabile Aluminium-Drahtbondverbindungen auf Ni-Pd-Au-plattierten LTCC-Substraten
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Dieter Schwanke, Holger Schulze, Deutsche IMAPS-Konferenz 2005, München
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Grundlagen und Möglichkeiten der Low Temperature Cofire Ceramic (LTCC)
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Dieter Schwanke: Vortrag des Monats auf Einladung des Kompetenzzentrums Neue Materialien Nordbayern Bayreuth, 2005
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Einfluss des Layouts auf die Zuverlässigkeit von BGAs
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T. Kraft, H. Riedel. C. Zeilmann, D. Schwanke, Deutsche IMAPS Konferenz 2005, München
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Improved Design Options and Microwave Performance by Combining Thin Film with LTCC (PDF, 354.5 KB)
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J. Müller, D. Schwanke, T. Haas, E. Feurer, B. Schweizer, A. Klaassen:, Workshop Proceedings WS8, 33rd European Microwave Conference, October 6, 2003, Munich.
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Improved Design Options and Microwave Performance by Combining Thin Fim with LTCC
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J. Müller, D. Schwanke, T. Haas, E. Feurer, B. Schweizer, A. Klaassen, Workshop Proceedings WS8, 33rd European Microwave Conference, October 6, 2003, Munich
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Reliability Investigations of BGA-Interconnections between RF-LTCC-Modules and PCBs (PDF, 577.3 KB)
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D. Schwanke, Th. Haas,Ch. Zeilmann, K. Halser, M. Klein, 14th EMPC, Friedrichshafen, June 2003
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Design and Evaluation of Hybrid LTCC Filters (PDF, 867.2 KB)
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J. Müller: 14th European Microelectronics and Packaging Conference, June 23-25, 2003, Friedrichshafen, Germany.
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Design Considerations for Hybrid LTCC-RF-Filters (PDF, 358.7 KB)
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J. Müller: Proceedings of the 2003 Ceramic Interconnect Technology Conference, April 7-9, 2003, Denver/CO, USA.
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Microwave and mm-meter wave applications: a new challenge for ceramic thick film technology (PDF, 332.2 KB)
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Vanrietvelde, E. Polzer, S. Nicotra, J. Mueller and A. Brokmeier:, IEEE Meeting, Oct. 2002.
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Lumped and distributed element design for LTCC radio filters (PDF, 3828.6 KB)
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Jens Müller, Claude Guichaoua:, Proceedings of IMAPS Nordic Conference, 29.09.-02.10.2002, Stockholm.
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In-process verification of MLC substrates (PDF, 443.4 KB)
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J. Müller, J. Klein, J. Rayho: European Microelectronics and Packaging Symposium, 16-18 June, 2002, Cracow/Poland.
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Embedded Capacitors for LTCC Applications above 20 GHz (PDF, 442.6 KB)
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Proceedings of Advanced Technology Workshop on Ceramic Applications for Microwave and Photonic Packaging, J. Müller, D. Josip, T. Müller, May 2-3, 2002, Providence/Rhode Island, USA.
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Möglichkeiten der passiven Integration in LTCC (PDF, 3714.5 KB)
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Jens Müller: IMAPS Seminar 14.02.2002, Göppingen.
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Integrated Capacitors using LTCC (PDF, 496.8 KB)
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J. Müller, D. Josip, Microtech Conference 2002, 29./30.01.2002, Manchester/UK.
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Use of an Optical Dilatometer for in-situ Shrinkage Measurements of LTCC Multilayer
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M. Wagner, A. Roosen, D. Schwanke, F. Bechtold, Ch. Schmaus, 13th European Microelectronics & Packaging Conference & Exhibition, IMAPS Europe 30 May-1 June 2001, Straßburg/F
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Charakterisierung und Schwindungsverhalten von LTCC - Grünfolien
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U. Deisinger, A. Stiegelschmidt, A. Roosen, D. Schwanke, F. Bechtold, Ch. Schmaus, PLUS 3, 2001, S.483-490
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Aufbau, Vorteile und Zuverlässigkeit von LTCC-Modulen mit Flip Chip Komponenten (PDF, 299.8 KB)
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Jens Müller: Präsentation DKG-Symposium LTCC-Module: Eine neue Integrationsstufe in der Elektronik und Sensorik, 24./25. Januar 2000, Dresden.
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Integrationspotential durch den Einsatz von Chip Scale Packages (PDF, 306.6 KB)
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J. Müller: IMAPS München, 9./10. Oktober 2000.
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Design, Substrate and Manufacturing Requirements
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J. Müller, T. Haas, M. Harnack, P. Chen, M. Johnson, T. Tessier: Wafer Scale CSP Technology, Proceedings 12th European Microelectronics & Packaging Conference & Exhibition, IMAPS Europe 7-9 June 99, Harrogate/U.K
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Wafer Scale CSP Technology: Design, Substrate and Manufacturing Requirements (PDF, 111.5 KB)
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J. Müller, T. Haas, M. Harnack, P. Chen, M. Johnson and T. G. Tessier: IMAPS Europe Conference, Harrogate/U.K., June 99.
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Wafer Level Chip Scale Packages - Anforderungen an Design, Substrat- und Fertigungstechnologie (PDF, 102.8 KB)
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J. Müller: Deutsches IMAPS Seminar Multi-Chip-Module, 25.02.1999, Göppingen.
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Wafer Scale CSP Technology: Design, Substrate and Manufacturing Requirements (PDF, 388.9 KB)
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J. Müller, T. Haas, M. Harnack, P. Chen, M. Johnson and T. G. Tessier:, IMAPS Europe Conference, Harrogate/U.K., June 99.
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Steigerung der Integrationsdichte in LTCC-Multilayer-Substraten durch konsequente Ausnutzung der Cofire-Technologie
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J. Müller, D. Schwanke, J. Gerdes, T. Haas, D. Josip, J. Klein, Deutsche ISHM Konferenz München, 12./13. Oktober 1998
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Performance of buried Resistors in Green TapeTM 951
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H. Thust, K.-H. Drüe, T. Thelemann, E. Polzer, J. Müller, Proceedings of the International Symposium of Microelectronics, Philadelphia, Oktober 1997
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Synthesis of 3D-Inductors with Optimized RF-Performance
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J. Müller, H. Riecke, T. Tuschick, Proceedings of the First Pan Pacific Conference, Honolulu/Hawaii, Febr. 1996
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High-Frequency Performance Comparison of MCM-C Materials
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J. Müller, H. Thust, D. Schwanke, International Journal of Microcircuits & Electronic Packaging, No. 4, 1996
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Recent Development Of Non-Active Integrated Components In Multilayer Moduls (PDF, 648.9 KB)
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Mussler B, Schwanke D., Proc. International Symposium on Tantalum and Niobium, Goslar, 24.-28. Sept. 1995
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LTCC-die zwingende Alternative (PDF, 568.3 KB)
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B. Mussler, D. Schwanke, Ch. Modes, " productronic" 8/95, Seite 40-46, Hüthig GmbH, Heidelberg
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