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Strabs

Project Name:

Stressarmes Fügen elektronischer Bauelemente durch Polymerformkörper für Temperaturanwendungen bis 200°C
Teilprojekt: Einsatz von Polymerformkugeln als Keramik/Leiterplatteninterface zur Erhöhung der Zuverlässigkeit von Hochtemperaturanwendungen

Acronym:

Strabs

Project Partners:

DIEHL Munitionssystem GmbH & Co. KG, Röthenbach a.d. Pegnitz
MPD GmbH, Dresden
Micro particles GmbH, Berlin
TU Dresden
FhG IZM

Duration:

2 years: 01.11.2002 - 31.10.2004

Funding:

PRO INNO (BMWi)

Short Description:

Coated polymer bumps will be applied to achieve a stress relief between materials with different thermal expansion coefficients. Ceramic-BGAs mounted on a PCB usually suffer from early fatigue failures in thermal cycling. The reliability itself depends on the maximum distance to the neutral point (dimension of the BGA bump array), the stand-off (bump size) and the differences in thermal expansion. The goal of the project is to find an optimum system of PCB-Pad, coated polymer bump and LTCC-Pad to achieve highest reliability without additional support like underfill.

Links:

n/a

Publications:

n/a

Bump array on LTCC

LTCC-BGA mounted on FR-4

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