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mikromedi

Project Name:

Highly-integrated microsystems for biomedical, aerospace and astronautics applications

Acronym:

mikromedi

Project Partners:

Micro Systems Engineering GmbH & Co.
Biotronik Mess- und Therapiegeräte GmbH & Co.
Diehl Stiftung & Co.
Fraunhofer Institut Zuverlässigkeit und Mikrointegration

Duration:

2 years: 01.04.1998 - 31.03.2000

Funding:

Bundesministerium für Bildung, Wissenschaft, Forschung und Technologie (BMBF), Heimannstr. 2, 53175 Bonn

Short Description:

The goal of the project was to build up a demonstrator which can be manufactured using a single assembly technology. Standard manufacturing concepts of pace maker circuits require a set of different technologies including soldering, glueing, wire bonding and welding. The demonstrator was designed for pure single sided soldering. To meet these goals booth a new substrate approach and die-attach method needed to be developed and qualified. Using a µVia-technology on a rigid-flex material together with a Chip Scale Packaging process was required to accomplish the tasks. In order to meet the stringend size requirements, an on-chip signal redistribution process was introduced on a wafer-level basis (FhG IZM CSP).

Links:

n/a

Publications:

Wafer Scale CSP Technology: Design, Substrate and Manufacturing Requirements
Wafer Level Chip Scale Packages - Anforderungen an Design, Substrat- und Fertigungstechnologie
Integrationspotential durch den Einsatz von Chip Scale Packages BMBF-Projekt Mikromedi

Rigid-Flex Demonstrator using CSP Assembly

X-section of Wafer Level Redistribution using the FhG-IZM Process

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