Micro Systems Engineering GmbH - Research & Development

Specifications for 40Gbit/s-transmission systems require circuit carriers with a very low dispersion in terms of signal transmission loss vs. frequency up to 50GHz. Standard LTCC systems do not meet this specification. Therefore, a new low loss system needs to be qualified taking into account the specific demands on the assembly technologies. Both soldering and wire-bonding are necessary for interconnection. FlipChip technology with a pitch down to 200µm as well as thermal issues for heat removal are addressed in the project.

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Test structure on heat sink

FlipChip Demonstrator

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