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aKoM

Project Name:

Adaptive Point-to-Multipoint Kommunikations-Module Subproject: Higly integrated ceramic multilayer substrates for microwave circuits

Acronym:

aKoM

Project Partners:

EADS Deutschland GmbH
DaimlerChrysler Aerospace Dornier
Enthone OMI (Deutschland) GmbH
Rosenberger GmbH
Gerhard Mercator Universität Duisburg
Fraunhofer Institut Zuverlässigkeit und Mikrointegration

Duration:

3 years: 01.10.1999 - 31.12.2002

Funding:

Bundesministerium für Bildung, Wissenschaft, Forschung und Technologie (BMBF), Heimannstr. 2, 53175 Bonn

Short Description:

The exploitation of the frequency band up to 40 GHz requires a tight strucural control of the transmission lines. Basis for the project is a rigid substrate based on LTCC technology. To obtain line widths down to 50µm under series conditions, several structuring processes need to be developed and optimised. In contrast to standard thin film technology, microwave strucutres can be arranged in several layers. This quasi three-dimensional approach supports new designs for impedance controlled transitions from one transmission line to another or to a wave guide. Embedding of passive components is another feature of LTCC. High-k-materials can be introduced to realise a buried capacitor for decoupling purposes. Embedded resistors can be used for wave absorbers.

Links:

n/a

Publications:

Einsatz von LTCC in Sende- /Empfangsmodulen
Integrated Capacitors using LTCC

Detail of a Line Filter

X-section of an Embedded Capacitor

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