Micro Systems Engineering GmbH - Quality Assurance - X-Ray System
  Micro Systems Engineering GmbH Sitemap
 Search
 Contact
Home
 Profile
 Products
 Quality
 Research
 Events


Home


Quality Assurance  

Test Capabilities  

Multiproduct Test System  

X-Ray System  

Customized Test System  

Open / Short Testing  

Validation / Qualification  

Traceability  


Current Job Offers  

Quality Assurance

X-Ray System


X-Ray microscopy is being applied to evaluate BGA and FlipChip interconnects as well as heat sink and die attach integrity.


X-Ray System 		 
Solder bumps on doughter board 		 
8 layer LTCC filter with integrated passives


Home | Quality Assurance | Test Capabilities | Validation / Qualification | Traceability
 
© 2012 Micro Systems Engineering GmbH, Schlegelweg 17, D-95180 Berg
Tel.: +49 (0)9293 78 - 0, Fax: +49 (0)9293 78 - 41
info.msegmbh@mst.com