Micro Systems Engineering GmbH - Products & Service

Micro Systems Engineering GmbH - Products & Service - Build Up Types

Micro Systems Engineering GmbH

Products & Service

Design Service

Substrate Manufacturing

LTCC

Thick Film

Thick Film Process Flow

Thick Film Features

Standard Thick Film Capabilities

Build Up Types

Multilayer Structure

Al2O3 Substrate Properties

Quality Performance Testing and Assurance

Advanced Assembly

Packaging

Current Job Offers

Products & Service

Build Up Types

Thick film circuits are available in a variety of layer structures from single sided with single layer to multilayer on two sides.

For more details please send a Design Rules Request by email.

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Tel.: +49 (0)9293 78 - 0, Fax: +49 (0)9293 78 - 41
info.msegmbh@mst.com