Micro Systems Engineering GmbH - Products & Service - Thick Film
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Thick Film




Standard Thick Film Ceramic (96% Alumina) substrates are engineered to minimize as-fired resistor variations and maximize aged adhesion values. Superior resistor stability is achieved by controlling the substrates' effects on the temperature coefficient of resistance.
Standard Thick Film Ceramic substrate is particularly well suited for small geometry, high resistor value circuitry.


Thick Film Process Flow

Thick Film Features

Al2O3 Substrate Properties

Quality Performance Testing and Assurance


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