Micro Systems Engineering GmbH - Products & Service

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Products & Service

LTCC Cavities & Windows

	Size	Standard	High End
A	Distance between Cavities	min. 5 mm	min. 2 mm (smaller features on request)
B	Inner Conductor - Cavity Spacing	min. 250 µm	min. 100 µm
C	Via - Cavity Spacing	min. 400 µm	min. 200 µm
D	Cavity Bottom Conductor - Cavity Wall Spacing	min. 250 µm	0 µm, max. 30% of cavity bottom
E	Cavity Shelve Edge - Conductor Spacing	min. 200 µm	min. 100 µm
F	Conductor Length on Cavity Shelve	min. 1000 µm	min. 400 µm
G	Top Conductor - Cavity Spacing	min.200 µm	min. 100 µm
H	Cavity Width / Length	min. 1.2 mm	min. 800 µm
I	Cavity Depth	4 layers	6 layers
J	Inner Conductor - Cavity Bottom Spacing	min. 250 µm	0 µm, max. 30% of the area
K	Cavity Bottom Thickness	min. 4 layer	min. 2 layers

For more details please send a Design Rules Request by email.

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