Micro Systems Engineering GmbH - Products & Service

Products & Service

Design Service

Substrate Manufacturing

LTCC

LTCC Process Flow

LTCC Features

Standard LTCC Capabilities

Integrated Passive Components

Cavities & Windows

Brazing Operations

LTCC Properties

Quality Performance Testing and Assurance

Thick Film

Advanced Assembly

Packaging

Current Job Offers

Products & Service

Standard LTCC Capabilities

Standard LTCC Dimensions:

Index	Sizes	Standard	High End
A	Line Width Preferred and Postfire	100µm 200µm	<100µm* 150µm
B	Line - Via Spacing	200µm	100µm
C	Line Spacing	200µm	<100µm*
D	Via Pitch	400µm**	300µm
E	Line - Edge Spacing	250µm	200µm
F	Via - Edge Spacing	400µm	400µm
G	Pad - Edge Spacing	200µm	200µm
H	Outer Via-Coverpad (postfire) Inner Via-Coverpad	250µm 200µm	150µm 150µm
I	Via Diameter (green) Thermal Vias	150µm 200µm	100µm 290µm

*Smaller lines and spaces on request.
**For 10-12 vias in a row 400µm are acceptable.
For 20-25 vias in a row you have to use a pitch of 500µm. If you have a via chain with more than 25 a pitch of 600µm is mandatory.

For more details please send a Design Rules Request by email.

© 2012 Micro Systems Engineering GmbH, Schlegelweg 17, D-95180 Berg
Tel.: +49 (0)9293 78 - 0, Fax: +49 (0)9293 78 - 41
info.msegmbh@mst.com