Micro Systems Engineering GmbH - Products & Service - Packaging
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Products & Service

Packaging


A variety of customized packaging options is available. Please contact us to discuss your specific requirements.


Materials I/O-Configurations Housing
- LTCC
- AI2O3
- PCB		 - Ball Grid Array
- Land Grid Array
- Castellation
- SIL / DIL
- QFP		 - Non Hermetic
  (Plastic Metal Cover Organic Coating)
- Hermetic
  (Soldering)




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Tel.: +49 (0)9293 78 - 0, Fax: +49 (0)9293 78 - 41
info.msegmbh@mst.com