Micro Systems Engineering GmbH - Products & Service - Wire Bonding Technologies
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Wire Bonding Technologies


Category Methods Application
Ultrasonic - Al-thin wire bonding
- Al-thick wire bonding		 Standard,
Fine Pitch Power
Devices
Thermosonic
Wedge/Wedge		 - Au-thin wire bonding
- Au cold wire bonding
- Ribbon Bonding		 Standard,
Microwave,
High-Rel
Thermosonic
Ball/Wedge		 - Au-thin wire bonding Standard,
High-Rel



Wedge/Wedge Finepitch
60µm
Al Heavy Wire on DCB


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