Micro Systems Engineering GmbH - Products & Service - Die Attach Technologies
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Substrate Manufacturing  

Advanced Assembly  

SMD Assembly Technologies  

Die Attach Technologies  

Wire Bonding Technologies  

Die Protection / Encapsulation  

SMT / Flip Chip Assembly Line  

Packaging  


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Products & Service

Die Attach Technologies


Category Methods Application
Gluing - Epoxy printing
- Epoxy dispensing
- Preforms		 Standard,
Die-on-Die,
RF-FlipChip
Soldering - Solder printing
- Solder dispensing
- Preforms		 Microwave, Medical,
Power Devices,
Automotive
Eutectic AuSi - Thermocompression Packaging,
Special Applications

High Precision Die-Bonder

Die-on-Die
Flip Chip Diode
Picking from
- Wafer
- Waffle Pack
- Gel-Pack


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