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Design Service  

Substrate Manufacturing  

Advanced Assembly  

SMD Assembly Technologies  

Die Attach Technologies  

Wire Bonding Technologies  

Die Protection / Encapsulation  

SMT / Flip Chip Assembly Line  

Packaging  


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Products & Service

Advanced Assembly


Surface mount technology on two lines, chip on board and FlipChip/Chip Scale Package assembly is available on both ceramic and organic (rigid/flex) boards.


SMD Assembly Technologies

Die Attach Technologies

Wire Bonding Technologies

Die Protection / Encapsulation

SMT / Flip Chip Assembly Line


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